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LOCTITE® HHD 3630BK – Polyurethane Hot Melt Adhesive for Structural and Electronic Bonding Applications

Item Name: LOCTITE® HHD 3630BK
Manufacturer: Henkel
Technologies: Polyurethane Hot Melt
Color: Black
Cure Type: Moisture and Solidification
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.

1. Product Overview

LOCTITE® HHD 3630BK is a black, odorless, one-part polyurethane hot melt adhesive that cures through moisture and solidification. It is reactive and provides strong initial strength immediately after solidification at the bondline. Designed for automated or manual assembly lines, it offers chemical and impact resistance with good bonding performance. Full cure is achieved within 1–5 days depending on humidity and substrate conditions, while handling strength is immediate.


2. Applications

  • Structural adhesive

  • Electronic structural bonding

Substrate pretreatment recommendations: Clean, dry, and oil-free surfaces; maintain substrate temperature above 20°C; preheating may be applied.

Application methods: Heating cartridge guns or syringe-type melting equipment; reduce temperature during longer rest periods to prevent viscosity increase.

3. Typical Properties

Property Value
Uncured Material
Technology Polyurethane Hot Melt
Appearance Black
Odor Odorless
Solids Content, % 100
Density @ 25°C, g/cm³ 1.1
Viscosity @ 110°C, mPa·s 6,000
Curing Performance
Open Time @ 25°C, min >3
Preheating Schedule @ 100°C, min 20–30
Application Temperature, °C 100–120
Cure Method Moisture and Solidification
Full Cure Time 1–5 days (depending on humidity and substrate conditions)
Cured Material
Tensile Strength, PC/GF to ink glass, N/mm² 1h @ 23°C, 60% RH: >3; 24h @ 23°C, 60% RH: >7

LOCTITE® HHD 3630BK exhibits immediate handling strength after bonding. Cure rate depends on environmental humidity, substrate moisture, permeability, and adhesive layer thickness. Optimal storage is 8–28°C in unopened containers.

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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