• Item Name: LOCTITE® HHD 3640BK
• Manufacturer: Henkel
• Technologies: Polyurethane Hot Melt
• Color: Black
• Cure Type: Moisture and Solidification
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
LOCTITE® HHD 3640BK is a reactive polyurethane hot-melt adhesive designed for structural bonding. It solidifies rapidly at the bondline, offering strong initial strength, excellent impact resistance, and good reworkability. The adhesive cures through moisture and solidification, with handling strength achieved immediately after bonding. It is odorless, black in appearance, and formulated for use in both automatic and manual assembly processes.
Structural adhesive
Electronic structural bonding
| Property | Value |
|---|---|
| Appearance | Black |
| Odor | Odorless |
| Solids (%) | 100 |
| Density @ 25°C (g/cm³) | 1.1 |
| Viscosity @ 110°C, Brookfield Thermosel (mPa·s / cP) | 7,850 |
| Open Time @ 25°C (min) | >4 |
| Preheating Schedule @ 100°C (min) | 20–30 |
| Application Temperature (°C) | 100–130 |
| Young’s Modulus (N/mm²) | 11.8 |
| Elongation @ Break (%) | 1,304 |
| Tensile Strength @ 25°C (N/mm²) | 9.58 |
| Lap Shear Strength, PC/GF to PC/GF (N/mm²) | 10.28 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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