LOCTITE HHD 4042 is a dual-cure structural adhesive designed for device assembly. It is formulated to cure initially under UV light, with a secondary heat cure to achieve maximum performance. The adhesive has a light yellow paste appearance and is suitable for electronic component assembly.
| Property | Value |
|---|---|
| Technology | Epoxy/Acrylate |
| Appearance | Light yellow paste |
| Viscosity (25°C, mPa·s) | 125,000 (Spindle 52, 0.5 rpm) |
| Specific Gravity (@ 25°C) | 1.63 |
| Pot Life (@ 25°C, days) | 8 (Keep away from light) |
| Curing Method | Conditions |
|---|---|
| UV Cure | 300 – 500 nm light wavelength |
| UV Tack-Free Time | <6 seconds |
| Heat Cure | 1 hour @ 120°C |
| Test | Value |
|---|---|
| Glass Transition Temperature (Tg) | 145°C |
| Coefficient of Thermal Expansion (Alpha 1) | 45.38×10⁻⁶ cm/cm/°C |
| Coefficient of Thermal Expansion (Alpha 2) | 138.73×10⁻⁶ cm/cm/°C |
| Volume Shrinkage on Cure | 3.1% |
| Substrate | Strength (N/mm²) | Strength (psi) |
|---|---|---|
| Steel | 21 | 3,045 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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