• Item Name: LOCTITE HHD 4042
• Manufacturer: Henkel
• Technologies: Epoxy/Acrylate
• Color: Light yellow paste
• Cure Type: Ultraviolet (UV) light, Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
LOCTITE HHD 4042 is a light yellow paste, dual-cure adhesive based on epoxy/acrylate technology. It is designed for electronic component assembly and structural bonding, curing initially with ultraviolet (UV) light followed by heat to achieve maximum performance. The adhesive provides strong physical properties, including high glass transition temperature and thermal stability. Its dual cure mechanism ensures rapid tack-free handling and full cure reliability.
Device assembly
Structural adhesive
Electronic component bonding requiring precise cure control
Curing recommendations: Initial UV exposure (300–500 nm) for rapid tack-free handling (<6 s), followed by heat cure (1 hour @ 120°C) for complete bonding.
| Property | Value |
|---|---|
| Uncured Material | |
| Technology | Epoxy/Acrylate |
| Appearance | Light yellow paste |
| Viscosity @ 25°C, mPa·s | 125,000 |
| Specific Gravity @ 25°C | 1.63 |
| Pot Life @ 25°C | 8 days (away from light) |
| Flash Point | See SDS |
| Curing Performance | |
| UV Wavelength, nm | 300–500 |
| UV Tack-Free Time, s | <6 |
| Heat Cure | 1 hour @ 120°C |
| Cured Material | |
| Glass Transition Temperature (Tg), °C | 145 |
| Coefficient of Thermal Expansion Alpha 1, cm/cm/°C | 45.38×10⁻⁶ |
| Coefficient of Thermal Expansion Alpha 2, cm/cm/°C | 138.73×10⁻⁶ |
| Volume Shrinkage on Cure, % | 3.1 |
| Lap Shear Strength, Steel N/mm² | 21 (3,045 psi) |
LOCTITE HHD 4042 provides dual-cure reliability, ensuring fast handling and high final strength. Proper storage in unopened containers at -40°C is recommended to maintain performance.
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.