Item Name: LOCTITE HHD 8150
Manufacturer: Henkel
Technologies: Acrylic
Color: Part A – Yellow, Part B – Blue, Mixed – Green
Cure Type: Room temperature cure after mixing
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
LOCTITE HHD 8150 is a two-component methacrylate adhesive system based on acrylic technology. It consists of Part A (yellow) and Part B (blue), which mix to form a green adhesive. The product is designed for room-temperature curing and provides fast cure, high strength, and a controlled bondline thickness using 125 µm spacers. It is optimized for structural bonding in handheld device assemblies.
Device assembly
Structural bonding
Controlled bondline applications where precise thickness and high strength are required
| Property | Part A | Part B | Mixed / Cured |
|---|---|---|---|
| Appearance | Yellow | Blue | Green |
| Viscosity @ 20 s⁻¹ (mPa·s / cP) | 45,000 | 45,000 | – |
| Flash Point | See SDS | See SDS | – |
| Peak Exotherm Temperature (ºC) | – | – | 95 |
| Peak Exotherm Time (min) | – | – | 5–10 |
| Hardness, Shore D | – | – | >50 (2 hrs @ 60ºC) |
| Tensile Modulus (MPa) | – | – | ≥500 (72 hrs @ 25ºC) |
| Lap Shear Strength, Anodized Aluminum (N/mm²) | – | – | >19 (24 hrs @ 25ºC) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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