• Item Name: LOCTITE® HHD 8170
• Manufacturer: Henkel
• Technologies: Acrylic, Methacrylate
• Color: Part A – Light to dark amber, Part B – Blue, Mixed – Light green
• Cure Type: Room temperature
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
LOCTITE® HHD 8170 is a two-component, room-temperature curable methacrylate adhesive. It is non-sag, forms resilient bonds, and maintains strength across a wide temperature range. The adhesive is suitable for structural bonding of plastics, metals, and dissimilar materials, especially in applications subjected to vibrations and impacts, such as portable devices.
Structural adhesive
Electronic structural bonding
Bonding of plastics, metals, or dissimilar materials requiring impact and vibration resistance
| Property | Uncured | Cured |
|---|---|---|
| Appearance | Part A: Light to dark amber Part B: Blue Mixed: Light green |
– |
| Components | Two components, requires mixing | – |
| Mix Ratio (Part A:Part B) | 10:1 | – |
| Viscosity (mPa·s, PP25, 0.5 mm gap, 20 s⁻¹) | Part A: 22,500 Part B: 45,000 |
– |
| Cure | Room temperature | 20 min @45°C + 24 h @ RT |
| Peak Exotherm (15 g mass) | Time: 4–6 min Temperature: ≥105°C |
– |
| Tensile Strength at break | – | 21.1 N/mm² |
| Tensile Modulus | – | 920 N/mm² |
| Elongation | – | 45.5% |
| Lap Shear Strength | – | Anodized Aluminum to Anodized Aluminum ≥19.3 N/mm² |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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