• Item Name: LOCTITE HHD 8520
• Manufacturer: Henkel
• Technologies: Acrylic, Methacrylate
• Color: Part A – Amber, Part B – Blue, Mixed – Green
• Cure Type: Room temperature
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
LOCTITE HHD 8520 is a two-component methacrylate adhesive with an amber resin (Part A) and blue hardener (Part B), forming a green mixture upon mixing. It offers long open time, room temperature cure capability, superior impact strength, medium elongation, high tensile strength, and is halogen-free compliant. The adhesive is formulated for structural bonding of metals and composites, maintaining resilient bonds and strength over a wide temperature range, suitable for plastic and metal components exposed to vibrations and impacts, such as in portable devices.
Structural bonding of plastic and metal components
Device assembly
Applications requiring resilient bonds with high impact resistance
| Property | Part A (Uncured) | Part B (Uncured) | Mixed / Cured |
|---|---|---|---|
| Appearance | Amber | Blue | Green |
| Viscosity (mPa·s, 25°C, 0.5 mm gap, 20 s⁻¹) | 25,000–40,000 | 30,000–60,000 | – |
| Flash Point | See SDS | See SDS | – |
| Components | Two-component, requires mixing | Two-component, requires mixing | – |
| Mix Ratio (Vol) | 10 : 1 | 10 : 1 | 10 : 1 |
| Cure | Room temperature | Room temperature | Room temperature after mixing |
| Open Time | – | – | 10–20 min |
| Peak Exotherm | – | – | ≥105°C, 10–20 min |
| Tensile Strength | – | – | 19–28 N/mm² |
| Elongation | – | – | 45% |
| Impact Strength (SUS/SUS) | – | – | Energy: 3.43 J; Peak Force: 6,180 N |
| Lap Shear Strength (Anodized Aluminum, 125 µm gap) | – | – | 19–28 MPa |
| Lap Shear Strength (Kalix, 125 µm gap) | – | – | 15–18 MPa |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: 41 Street 2, Van Phuc Zone, Hiep Binh Phuoc, Thu Duc City, Ho Chi Minh City, 70000, Vietnam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.