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LOCTITE® HY 4070™ – Structural Hybrid Adhesive – Bonding plastics, rubbers, and metals

  • Item No: HY 4070
  • Manufacturer: Henkel
  • Technologies: Cyanoacrylate, Acrylic
  • Color: Transparent to pale yellow
  • Cure Type: Room temperature cure
  • Package Size: Contact to Techniq VN for details
  • Shelf Life: Contact to Techniq VN for details

1. Product Overview

LOCTITE® HY 4070™ is a two-component hybrid adhesive combining cyanoacrylate and acrylic technologies. It offers fast fixture times at room temperature in bond gaps up to 5 mm, with excellent adhesion to various substrates such as plastics, rubbers, and metals. It is designed for applications requiring complete cure of excess adhesive, as well as resistance to temperature and moisture. Its gel consistency prevents flow, making it suitable for vertical applications.

2. Applications

  • Bonding plastics, rubbers, and metals
  • Applications requiring gap filling up to 5 mm
  • Situations where temperature and moisture resistance are necessary
  • Vertical surface bonding due to its non-sag gel consistency

3. Typical Properties

Property Part A Part B
Chemical Type Cyanoacrylate Methacrylate
Appearance Transparent to pale yellow Clear to slightly yellow
Specific Gravity @ 25°C 1.05 – 1.1
Viscosity (mPa·s) 200 – 1,300 1 – 30
Mix Ratio (by volume) 10:1
After Mixing and Curing
Property Value
Gel Time in Nozzle 4 – 5 minutes
Fixture Time on Aluminum <60 sec (0.05 mm gap), 4 – 6 min (2 mm gap)
Glass Transition Temperature (°C) 110
Shore Hardness (D) 65
Tensile Strength (N/mm²) 14.6
Elongation at Break (%) 4.9
Lap Shear Strength on Mild Steel (N/mm²) 25
Lap Shear Strength on Aluminum (N/mm²) 15 – 20
Impact Strength (kJ/m²) 4.2

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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