LOCTITE® PA 6682 is a high-performance thermoplastic polyamide hot melt adhesive designed for low-pressure molding applications, particularly in the medical device industry. It offers:
This product has been tested per Henkel’s ISO 10993 biocompatibility protocols for medical applications.
| Property | Test Standard | Value |
|---|---|---|
| Physical Properties | ||
| Specific Gravity @ 23ºC | ISO 1183 | 0.98 |
| Softening Point (°C) | ASTM E28 | 155 |
| Melting Viscosity (mPa·s) | ASTM D3236 | @190°C: 7,800 @200°C: 4,300 @210°C: 3,200 @220°C: 2,000 |
| Mechanical Properties | ||
| Shore Hardness (Durometer A) | ISO 868 | 90 |
| Elongation (%) | ASTM D638 | 600 |
| Low Temp. Flexibility (°C) | ASTM D3111 | -25 |
| Temperature Creep Resistance (°C) | ELTM 1020 | 135 |
| Glass Transition Temp. (Tg) (°C) | DSC Second Run | -15 |
| Water Absorption (1 day @ 23ºC) (%) | ISO 62 | 0.9 |
| Tensile Strength at Break (N/mm²) | ASTM D638 | 7 (1,015 psi) |
| Yield Strength (N/mm²) | ASTM D638 | 5.5 (800 psi) |
| E-Modulus (N/mm²) | ASTM D638 | 80 (11,600 psi) |
| Electrical Properties | ||
| Dielectric Constant / Dissipation Factor @ 5-50 GHz | Open-ended coaxial probe | 2.45-2.5 / 0.009-0.014 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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