| Property | Value |
|---|---|
| Specific Gravity | 0.98 |
| Viscosity (Brookfield RVT, 25°C, Spindle 2, 20 rpm) | 200 to 850 mPa·s (cP) |
| Flash Point | See SDS |
| Property | Value |
| Tack-Free Time (Zeta® 7200, 70 mW/cm² @ 365 nm) | ≤30 seconds |
| Depth of Cure (60 sec, 70 mW/cm² @ 365 nm, Zeta® 7200) | ≥4 mm |
(Cured @ 70 mW/cm² @ 365 nm for 60 sec, followed by 24 hrs @ 22°C, 50±5% RH)
| Property | Value |
| Shore Hardness (ISO 868, Durometer A) | 45 to 65 |
| Elongation at Break (ISO 527-3) | >80% |
| Tensile Strength (ISO 527-3) | >6.0 N/mm² (870 psi) |
| Compression Set (ASTM D 395, Method B, 24 hrs @ 22°C) | 7.9% |
| Dielectric Breakdown Strength (IEC 60243-1) | 15.3 kV/mm |
| Volume Resistivity (IEC 60093) | 1.10×10¹⁵ Ω·cm |
(Cured @ 70 mW/cm² @ 365 nm for 60 sec per side, plus 24 hrs @ 22°C, 50±5% RH)
| Substrate Combination | Lap Shear Strength (N/mm²) |
| Aluminum to Glass | 2.4 (355 psi) |
| Steel to Glass | 2.7 (400 psi) |
| Polycarbonate to Polycarbonate | 4 (590 psi) |
| Polycarbonate to Aluminum | 4.5 (650 psi) |
| Polycarbonate to Steel | 2.6 (380 psi) |
| Polycarbonate to ABS | 3.7 (540 psi) |
| Glass to PVC | 2.3 (330 psi) |
| Glass to Nylon | 1.3 (190 psi) |
| Test Condition | Change in Durometer (Points) | Change in Tensile Strength (%) | Change in Elongation (%) |
| Aged @ 177°C for 168 hrs | -22 | -64 | -24 |
| Aged @ 100°C for 168 hrs (Glycol/Water 50:50) | -10 | -14 | -9 |
| Aged @ 150°C for 168 hrs (5W30 oil) | -38 | -92 | +21 |
| Aged @ 150°C for 168 hrs (ATF) | -57 | -97 | +16 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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