| Property | Value |
|---|---|
| Specific Gravity (25°C) | 1.11 |
| Flow (ISO 7390) | 0 mm (Thixotropic) |
| Extrusion Rate | 140 – 300 g/min |
| Condition | Skin Over Time | Tack Free Time |
|---|---|---|
| Cured @ 250 mW/cm² | 2 sec | 4 sec |
| Cured @ 75 mW/cm² | 2 sec | 6 sec |
| Moisture Cure (7 days) | 77 min | 93 min |
| Property | Value |
|---|---|
| Tear Strength (ISO 34-1) | 13.2 N/mm (75 lb./in) |
| Water Absorption (ISO 62, 24h) | 0% |
| Shore Hardness (ISO 868) | 32 – 47 |
| Elongation (ISO 37) | ≥250% |
| Tensile Strength (ISO 37) | ≥3.4 N/mm² (≥493 psi) |
| Property | Value |
|---|---|
| Dielectric Constant (100 Hz) | 2.99 |
| Dielectric Breakdown Strength | 490 kV/mm |
| Volume Resistivity | 5.5 × 10¹⁴ Ω·cm |
| Substrate | Lap Shear Strength (N/mm²) | 180° Peel Strength (N/mm) |
|---|---|---|
| Aluminum to Glass | 1.2 (175 psi) | 2.1 (12 lb/in) |
| Steel to Glass | 1.5 (217 psi) | 2.3 (13 lb/in) |
| Glass to Glass | 1.4 (203 psi) | 5.4 (31 lb/in) |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
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