LOCTITE® SI 5089™ is a one-component alkoxy silicone sealant that cures using UV light and atmospheric moisture. It forms a durable, flexible rubber suitable for gasketing and sealing applications. The product has a medium, thixotropic viscosity, ensuring minimal migration after application.
| Property | Value |
|---|---|
| Chemical Type | Alkoxy silicone |
| Appearance | Straw-colored liquid |
| Specific Gravity @ 25 °C | 1.05 |
| Viscosity (Spindle 6, 2.5 rpm) | 80,000 – 125,000 mPa·s |
| Solids/Non-Volatile Content | ≥95% |
| Cure Type | UV light (primary), Moisture (secondary) |
| Condition | Depth of Cure (mm) |
|---|---|
| 72 hours @ 22 °C | 0.58 |
| 30 sec @ 70 mW/cm² (365 nm) | 1.52 |
| 60 sec @ 70 mW/cm² (365 nm) | 1.78 |
| 30 sec @ 200 mW/cm² (365 nm) | ≥1.3 |
| 60 sec @ 200 mW/cm² (365 nm) | 2.03 |
| Property | Value |
|---|---|
| Tensile Strength (ISO 37) | ≥1.0 N/mm² (145 psi) |
| Elongation (ISO 37) | 190% |
| Shore Hardness (ISO 868) | ≥25 (A) |
| Tear Strength (ISO 34-1, Die B) | ≥1.5 N/mm (8.57 psi) |
| Flexibility @ -54 °C | Pass (3.2 mm mandrel) |
| Property | Value |
|---|---|
| Dielectric Breakdown Strength | 500 kV/mm |
| Volume Resistivity | 1.1×10¹⁵ Ω·cm |
| Dielectric Constant / Dissipation Factor (1 kHz) | 3.08 / 0.001 |
| Substrate Combination | Strength (N/mm²) | Strength (psi) |
|---|---|---|
| Aluminum to Polycarbonate | 0.1 | 15 |
| Steel to Polycarbonate | 0.1 | 15 |
| Polycarbonate to Polycarbonate | 0.07 | 10 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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