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Thermal Management

LOCTITE® SI 5240™ – Sealant – Bonding, Potting, Coating, Sealing

Item Name: LOCTITE® SI 5240™
Manufacturer: Henkel
Technologies: Silicone
Color: Clear liquid with yellow to green tint (slight haze permissible)
Cure Type: Ultraviolet (UV) / Visible light with secondary moisture cure
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.

1. Product Overview

LOCTITE® SI 5240™ is a one-component, alkoxy silicone-based sealant that cures with ultraviolet (UV) and visible light, with a secondary moisture cure for shadowed areas. It forms a medium-strength, flexible rubber sealant with excellent flow characteristics, making it suitable for various industrial applications.

2. Applications

  • Bonding
  • Potting
  • Coating
  • Sealing

3. Typical Properties

Uncured Material
Property Value
Specific Gravity 1.06
Viscosity (Brookfield RVT, Spindle 5, 10 rpm) 15,000 – 35,000 mPa·s (cP)
Appearance Clear liquid with yellow to green tint
Curing Performance
Condition Time
UV Cure (Zeta® 7760, 225 mW/cm²) 50 – 55 sec
UV Cure (Electrodeless, 500 mW/cm²) 5 – 10 sec
Depth of Cure (70 mW/cm² @ 365 nm, 60 sec) ≥10 mm
Cured Material Properties
Property Value
Shore Hardness (Durometer A) ≥40
Elongation at Break 250 – 450%
Tensile Strength ≥3 N/mm² (≥435 psi)
Tear Strength (ISO 34-1, Die C) 12.6 N/mm (72 lb./in.)
Volume Resistivity 1.2 × 10¹⁵ Ω·cm
Dielectric Breakdown Strength 21 kV/mm
Environmental Resistance
Aging Condition Change in Properties
85°C, 85% RH (168 hrs) -84% Tensile Strength, -64% Elongation
100°C (168 hrs) +26% Tensile Strength, -26% Elongation
150°C (168 hrs) -47% Tensile Strength, -27% Elongation

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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