LOCTITE® SI 5293 is a one-component, UV-curable alkoxy silicone conformal coating designed to provide environmental protection for printed circuit boards (PCBs) and other sensitive electronic components. It fluoresces under UV light and has a secondary moisture cure for shadowed areas.
| Property | Value |
|---|---|
| Appearance | Transparent amber to yellow liquid |
| Specific Gravity @ 25°C | 1.0 |
| Flash Point | See SDS |
| Viscosity (Brookfield RVT, Spindle 1, 10 rpm) | 400 to 800 cP |
| Solids Content | ≥85% |
| Property | Value |
|---|---|
| UV Cure Wavelength | 365 nm |
| Surface Tack-Free Time @ 22°C / 50% RH | 10 to 24 hours |
| Full Cure Time at Ambient Conditions | 72 hours |
Physical Properties:
| Property | Value |
|---|---|
| Coefficient of Thermal Expansion | 300 × 10⁻⁶ K⁻¹ |
| Thermal Conductivity | 0.18 W/(m·K) |
| Glass Transition Temperature (Tg) | -40°C |
| Water Vapor Transmission Rate | 1.23 – 1.37 g/(h·m²) |
Electrical Properties:
| Property | Value |
|---|---|
| Volume Resistivity | 1×10¹⁴ Ω·cm |
| Dielectric Breakdown Strength | 16 kV/mm |
| Dielectric Constant / Dissipation Factor | |
| @ 100 Hz | 4.6 / 0.005 |
| @ 1 kHz | 4.1 / 0.006 |
| @ 1 MHz | 4.1 / 0.006 |
Other Cured Properties:
| Property | Value |
|---|---|
| Shore Hardness (Durometer OO) | 60 to 90 |
| UV Depth of Cure | ≥1.3 mm |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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