| Property | Value |
|---|---|
| Specific Gravity @ 25°C | 1.04 |
| Extrusion Rate (g/min) | 25-55 |
| Flow (ISO 7390, mm) | <2 |
| Property | Value |
|---|---|
| Shore Hardness (ISO 868, A) | 25 |
| Elongation at Break (ISO 37, %) | 530 |
| Tensile Strength (ISO 37, N/mm²) | 2.5 (360 psi) |
| Property | Value |
|---|---|
| Dielectric Breakdown Strength (kV/mm) | 18 |
| Volume Resistivity (Ω·cm) | 1×10¹⁴ |
| Dielectric Constant (1 MHz) | 2.8 |
| Substrate | Strength (N/mm²) | Strength (psi) |
|---|---|---|
| Aluminum (1 mm thick, sand-blasted) | 2 | 290 |
| Fluid | Volume Swell (%) | Tensile Strength Change (%) | Elongation Change (%) |
|---|---|---|---|
| Sodium Carbonate (25%) | -0.2 | -12 | -10 |
| Sodium Chloride (25%) | -0.1 | 0 | 0 |
| Hydrochloric Acid (2%) | -0.1 | -8 | -8 |
| Lactic Acid (12%) | 0.3 | 4 | 10 |
| Citric Acid (12%) | -0.1 | -0.3 | 0 |
| Soda (25%) | -7 | -15 | -15 |
| Bleach (Commercial) | -1 | -20 | -15 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
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