LOCTITE® SI 5399™ is a one-component acetoxy silicone sealant that cures at room temperature via exposure to atmospheric moisture. It is primarily used for sealing, bonding, and high-temperature protection in industrial applications. This product is suitable for use in environments up to 350°C.
| Property | Value |
|---|---|
| Specific Gravity @ 20°C | 1.04 |
| Extrusion Rate (3mm Nozzle, 0.6MPa, 25°C) | 250 g/min |
| Thixotropic | Yes (Reduced migration after application) |
| Surface Cure (Tack-Free Time) | 5 min @ 23°C, 50% RH |
| Property | Value |
|---|---|
| Shore Hardness (A) | 33 |
| Elongation at Break (%) | 500 |
| Tensile Strength (N/mm²) | 3.3 (475 psi) |
| Tensile Modulus (N/mm²) | 0.8 (120 psi) |
| Property | Value |
|---|---|
| Volume Resistivity (Ω·cm) | 7.3×10¹⁵ |
| Dielectric Strength (kV/mm) | 23.3 |
| Dielectric Constant (1MHz) | 2.4 |
| Substrate | Lap Shear Strength (N/mm²) | psi |
|---|---|---|
| AG3 Aluminum | 2.5 | 360 |
| AG3 Aluminum (1mm Gasket) | 1.7 | 250 |
| Alclad Aluminum (1mm Gasket) | 1.6 | 230 |
| Property | Value |
|---|---|
| Volume Swell (%) | 21 |
| Shore Hardness (A) | 14 |
| Tensile Modulus (N/mm²) | 0.4 (60 psi) |
| Tensile Strength (N/mm²) | 1.65 (240 psi) |
| Elongation at Break (%) | 590 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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