LOCTITE SI 5421 is a one-component, alkoxy silicone adhesive that cures at room temperature via moisture exposure. It forms a flexible, electrically conductive bond and is primarily used for automotive sensor bonding and gasketing of EMI/RF shielded enclosures.
| Property | Value |
|---|---|
| Specific Gravity (@ 20°C) | 3.05 – 3.3 |
| Appearance | Tan Paste |
| Flash Point | See SDS |
| Property | Condition | Value |
|---|---|---|
| Tack-free Time | 23±2°C / 50±5% RH | 1 hour |
| Full Cure Time | 72 hours | – |
| Property | Standard | Value |
|---|---|---|
| Tensile Strength | ISO 37 | ≥0.7 N/mm² (≥102 psi) |
| Elongation | ISO 37 | ≥40% |
| Shore Hardness (A) | ISO 868 | 50 – 65 |
| Property | Standard | Value |
|---|---|---|
| Volume Resistivity | IEC 60093 | ≤0.01 Ω·cm |
| Property | Standard | Value |
|---|---|---|
| Lap Shear Strength (Alclad to Alclad) | ISO 4587 | ≥0.4 N/mm² (≥58 psi) |
LOCTITE SI 5421 provides shielding across a wide frequency range, offering significant attenuation at 30% compression level.
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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