LOCTITE SI 5421 is a one-component, alkoxy silicone adhesive that cures at room temperature (RTV) to form a flexible, electrically conductive bond. It is primarily used for automotive sensor bonding and gasketing of EMI/RF shielded enclosures.
| Property | Value |
|---|---|
| Specific Gravity @ 20°C | 3.05 – 3.3 |
| Flash Point | Refer to SDS |
| Property | Value | Standard |
|---|---|---|
| Tensile Strength | ≥0.7 N/mm² (≥102 psi) | ISO 37 |
| Elongation | ≥40% | ISO 37 |
| Shore Hardness (A) | 50 – 65 | ISO 868 |
| Property | Value | Standard |
|---|---|---|
| Volume Resistivity | ≤0.01 Ω·cm | IEC 60093 |
| Property | Value | Standard |
|---|---|---|
| Lap Shear Strength (Alclad to Alclad) | ≥0.4 N/mm² (≥58 psi) | ISO 4587 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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