LOCTITE® SI 5910® is a one-component oxime silicone sealant that cures at room temperature (RTV). It is a thixotropic black paste that offers excellent resistance to automotive engine oils and withstands high joint movement. Its non-sag properties prevent migration after application.
| Property | Value |
|---|---|
| Chemical Type | Oxime Silicone |
| Appearance | Black Paste |
| Viscosity | Thixotropic Paste |
| Specific Gravity (20°C) | 1.34 |
| Extrusion Rate (0.62 MPa, 25°C, 15s) | 300 – 650 g/min |
| Tack-Free Time (@ 25°C, 50% RH) | ≤ 40 min |
| Property | Value |
|---|---|
| Shore Hardness (Durometer A, ISO 868) | 30 |
| Elongation at Break (ISO 37) | ≥ 400% |
| Tensile Strength (ISO 37) | ≥ 1.7 N/mm² (≥ 247 psi) |
| Tensile Strength at 100% Elongation (ISO 37) | 0.6 – 1.0 N/mm² (87 – 145 psi) |
| Property | Value |
|---|---|
| Volume Resistivity (IEC 60093) | 1.69 × 10¹⁴ Ω·cm |
| Surface Resistivity (IEC 60093) | 2.81 × 10¹⁶ Ω |
| Dielectric Constant (IEC 60250, 1 kHz) | 4.53 |
| Dissipation Factor (IEC 60250, 1 kHz) | 0.019 |
| Substrate | Lap Shear Strength (N/mm²) | Lap Shear Strength (psi) |
|---|---|---|
| Mild Steel | 0.9 – 1.4 | 130 – 200 |
| Aluminum 2024-T3 | 0.6 – 1.4 | 90 – 200 |
| Alclad | 1.0 – 1.6 | 145 – 230 |
| Zinc Dichromate | 1.0 – 1.6 | 145 – 230 |
| Environment | Tensile Strength (N/mm²) | Elongation (%) |
|---|---|---|
| 22°C | 1.7 | 700 |
| 150°C | 2.4 | 600 |
| 175°C | 1.9 | 560 |
| 200°C | 2.2 | 400 |
| 5W40 Oil @ 120°C | 2.2 | 370 |
| Motor Oil @ 150°C | 2.0 | 340 |
| Water/Glycol | 1.4 | 300 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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