Epoxy Encapsulant
LOCTITE STYCAST 2651-40 W1 GOLD is a low-viscosity epoxy encapsulant designed for potting and encapsulation applications. It cures at room temperature or with heat and is compatible with various catalysts. The cured material is machinable using carbide tools.
| Property | Value |
|---|---|
| Uncured Properties | |
| Viscosity @ 25°C | 33,000 mPa∙s (cP) |
| Density | 1.5 g/cm³ |
| Shelf Life @ 18-25°C | 365 days |
| Mixed Properties (with Catalyst) | LOCTITE CAT 9 |
| Mix Ratio (by weight) | 100:8 to 9 |
| Pot Life | 30 minutes |
| Cured Properties | |
| Hardness (Shore D) | 87.5 |
| Thermal Conductivity | 0.5 W/(m-K) |
| Coefficient of Thermal Expansion | 78 ppm/°C |
| Linear Shrinkage | 0.2% |
| Moisture Absorption (24 hrs) | 0.3% |
| Operating Temperature | -40°C to +175°C |
| Electrical Properties | |
| Volume Resistivity | 1×10¹⁴ ohm-cm |
| Dielectric Strength | 17.7 kV/mm |
| Dielectric Constant @ 1 MHz | 3.8 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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