LOCTITE STYCAST 2762FT CAT 17M-1 is a high-performance epoxy encapsulant designed for potting electronic components exposed to harsh environments. It offers excellent high-temperature resistance, high thermal conductivity, and superior chemical resistance. The product is suitable for large and complex castings, providing low shrinkage and a low coefficient of thermal expansion.
| Property | Value |
|---|---|
| Technology | Epoxy |
| Appearance (Resin) | Black |
| Viscosity (mPa·s) | 250,000 |
| Density (g/cm³) | 2.4 |
| Shelf Life @ 25°C | 365 days |
| Property | Value |
|---|---|
| Mixed Viscosity (mPa·s) | 150,000 |
| Mixed Density (g/cm³) | 2.23 |
| Mix Ratio (By Weight) | 100:10 |
| Work Life @ 25°C (100g) | 24 hours |
| Casting Size | Curing Condition |
|---|---|
| Regular Castings | 3 hours @ 125°C + 3 hours @ 175°C |
| Large Castings | 16 hours @ 65°C + 6 hours @ 125°C + 6 hours @ 150°C |
| Post Cure (Optimal) | 4-6 hours at the highest expected use temperature |
| Property | Value |
|---|---|
| Hardness (Shore D) | 94 |
| Thermal Conductivity (W/m-K) | 1.34 |
| Operating Temperature (°C) | -20 to +230 |
| Dielectric Strength (kV/mm) | 15 |
| Dielectric Constant @ 1 MHz | 5.8 |
| Dissipation Factor @ 1 MHz | 0.01 |
| Volume Resistivity (ohm-cm) | >1×10¹⁵ |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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