LOCTITE STYCAST 2851FT is a one-component, solvent-free epoxy encapsulant designed for heat dissipation and thermal shock resistance. It features:
Recommended for encapsulation of components requiring:
| Uncured Properties | Value |
|---|---|
| Viscosity @ 25°C | 85,000 mPa·s |
| Viscosity @ elevated temp | 33,000 mPa·s |
| Density | 2.3 g/cm³ |
| Shelf Life (0 to 8°C) | 180 days |
| Cured Properties | Value |
|---|---|
| Hardness (Shore D) | 90 min |
| Thermal Conductivity | 1.36 W/m-K |
| Coefficient of Thermal Expansion | 31 ppm/°C |
| Moisture Absorption (24h) | 0.06% |
| Heat Distortion Temperature | 102°C |
| Arc Resistance | 207 sec |
| Property | Value |
|---|---|
| Impact Strength | 0.16 J/cm |
| Compressive Strength | 130 N/mm² (18,855 psi) |
| Flexural Strength | 93 N/mm² (13,488 psi) |
| Tensile Strength | 50 N/mm² (7,250 psi) |
| Volume Resistivity @ 25°C | 1×10¹⁵ ohm-cm |
| Dielectric Constant (1 MHz) | 5.2 |
| Dissipation Factor (1 MHz) | 0.02 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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