LOCTITE STYCAST 2851FT is a one-component, solvent-free epoxy encapsulant designed for heat dissipation and thermal shock resistance. It features:
Recommended for encapsulation of components requiring:
| Uncured Properties | Value |
|---|---|
| Viscosity @ 25°C | 85,000 mPa·s |
| Viscosity @ elevated temp | 33,000 mPa·s |
| Density | 2.3 g/cm³ |
| Shelf Life (0 to 8°C) | 180 days |
| Cured Properties | Value |
|---|---|
| Hardness (Shore D) | 90 min |
| Thermal Conductivity | 1.36 W/m-K |
| Coefficient of Thermal Expansion | 31 ppm/°C |
| Moisture Absorption (24h) | 0.06% |
| Heat Distortion Temperature | 102°C |
| Arc Resistance | 207 sec |
| Property | Value |
|---|---|
| Impact Strength | 0.16 J/cm |
| Compressive Strength | 130 N/mm² (18,855 psi) |
| Flexural Strength | 93 N/mm² (13,488 psi) |
| Tensile Strength | 50 N/mm² (7,250 psi) |
| Volume Resistivity @ 25°C | 1×10¹⁵ ohm-cm |
| Dielectric Constant (1 MHz) | 5.2 |
| Dissipation Factor (1 MHz) | 0.02 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.