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LOCTITE STYCAST 5952-1 – Silicone Potting/Encapsulant – Encapsulation of transformers, rectifiers, power supplies, and heat generating modules

  • Item Name: LOCTITE STYCAST 5952-1
  • Manufacturer: Henkel Corporation
  • Product category: Silicone-based potting/encapsulation material
  • Technologies: Two-component silicone system (1:1 mix ratio)
  • Applications: Ideal for potting and encapsulating heat-generating electronic components such as transformers, rectifiers, thyristors, and power supplies.
  • Color: Part A is Red; Part B is White
  • Cure type: Heat cure
  • Package size: Contact to Techniq VN for details
  • Shelf life: Approximately 6 months (183 days)

1. Product Overview

LOCTITE STYCAST 5952-1 is a two-component silicone-based potting and encapsulant material. It is electrically non-conductive, offers good elongation strength, moderate tear strength, and high thermal conductivity. The product is designed for encapsulating heat-generating devices and applications requiring a non-corrosive casting and coating.

2. Applications

  • Typical Assembly Applications: Transformers, rectifiers, thyristors, power supplies, and heat-generating modules.
  • Other Applications: Thermally conductive roll coatings, heat sinks, and thermal pads.

3. Typical Properties

Uncured Material
Property Part A Part B Mixed
Appearance Red White
Viscosity @ 25°C (mPa·s) 60,000 25,000 30,000
Density (g/cm³) 2.05 2.125 2.05
Storage Life (days) 183 183
Mixed Pot Life @ 100°C (min) 100
Curing Performance
  • Standard Cure: 1 hour @ 100°C
  • Handling Time: 24 hours at room temperature
  • Optimal Performance: Additional post-cure of 2 hours at 175°C
Cured Material Properties
Property Value
Hardness (Shore A) 75
Coefficient of Linear Thermal Expansion (10⁻⁴ K⁻¹) 2
Elongation (%) 45
Thermal Conductivity (W/m-K) 0.8
Volume Resistivity @ 25°C (ohm-cm) 1×10¹⁴
Dielectric Constant @ 1 MHz 5.0
Dielectric Loss @ 1 MHz 0.01
Dielectric Strength (kV/mm) 17
Tensile Strength (N/mm²) 4 (580 psi)

4. Directions for Use

  1. Mixing: Thoroughly mix Parts A and B in a 1:1 ratio using power mixing.
  2. Air Removal: Evacuate the resin mixture to remove entrapped air.
  3. Application: Pour into the cavity or mold.
  4. Adhesion Improvement: Use PRIMER S 11NC to enhance adhesion to non-silicone materials.

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