LOCTITE STYCAST ES 4512 is a two-component epoxy casting system designed for potting and encapsulation. It offers excellent handling properties, low cost, and flexibility. The system contains a non-abrasive filler, making it suitable for both machine metering/dispensing and manual mixing applications.
| Property | Part A (Resin) | Part B (Hardener) | Mixed |
|---|---|---|---|
| Appearance | Black | Tan | Black (cured) |
| Density @ 25°C (g/cm³) | 1.57 | 1.48 | 1.55 |
| Filler Content (%) | 50 | 60 | – |
| Viscosity @ 25°C (mPa·s) | 55,000 (2 rpm) / 28,000 (20 rpm) | 6,300 (20 rpm) | 19,000 |
| Pot Life @ 25°C (200 g mass) | – | – | 60 min |
| Gel Time @ 25°C | – | – | 5 hours |
| Peak Exotherm Temp (200 g mass) | – | – | 90°C |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) | 50°C |
| Thermal Conductivity | 0.644 W/(m-K) |
| Coefficient of Thermal Expansion (Pre Tg) | 66 × 10⁻⁶ K⁻¹ |
| Shore Hardness (D) | 88 |
| Water Absorption (24h @ 25°C) | 0.32% |
| Elongation (%) | 6.3 |
| Tensile Strength | 18.4 N/mm² (2,670 psi) |
| Compressive Strength | 80.7 N/mm² (11,700 psi) |
| Flexural Strength | 34.3 N/mm² (4,975 psi) |
| Tear Strength | 42 N/mm (240 lb./in.) |
| Property | Value |
|---|---|
| Dielectric Breakdown Strength | 44.7 kV/mm |
| Volume Resistivity @ 25°C | 5.9 × 10¹⁴ Ω·cm |
| Surface Resistivity @ 25°C | 3.0 × 10¹⁵ Ω |
| Dielectric Constant / Dissipation Factor (25°C) | 4.6 / 0.038 (100 Hz) |
| Dielectric Constant / Dissipation Factor (105°C) | 35.7 / 1.43 (100 Hz) |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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