LOCTITE STYCAST ES 6005 is a resilient, low-cost, fast-gelling epoxy potting compound. It is designed for high-volume encapsulation and works efficiently with 2:1 meter-mix-dispense machinery while minimizing abrasion.
LOCTITE STYCAST ES 6005 is suitable for:
✔ Potting and encapsulating high-volume electronic parts
✔ Applications requiring fast gel times and low abrasion
✔ Use with automated dispensing systems
| Property | Part A (Resin) | Part B (Hardener) |
|---|---|---|
| Density @ 25°C (g/cm³) | 1.63 | 0.97 |
| Viscosity @ 25°C (mPa∙s) | 11,000 | 170 |
| Property | Mixed Material |
|---|---|
| Density @ 25°C (g/cm³) | 1.41 |
| Viscosity @ 25°C (mPa∙s) | 1,500 |
| Pot Life @ 25°C (400g mass) | 10 minutes |
| Gel Time @ 25°C (400g mass) | 25 minutes |
| Property | Value | Standard |
|---|---|---|
| Glass Transition Temperature (°C) | 14 | ISO 11357-2 |
| Thermal Expansion (K⁻¹) | 47×10⁻⁶ (Pre-Tg) / 167×10⁻⁶ (Post-Tg) | ASTM D7012 |
| Thermal Conductivity (W/m-K) | 0.288 | ISO 8302 |
| Hardness (Shore D) | 70 | ISO 868 |
| Water Absorption (% @ 25°C, 24h) | 0.3 | ISO 62 |
| Tensile Strength (N/mm² / psi) | 12.4 / 1,800 | ISO 527-2 |
| Property | Value | Standard |
|---|---|---|
| Volume Resistivity (Ω·cm) | 4.9×10¹³ | IEC 60093 |
| Surface Resistivity (Ω) | 5.4×10¹⁴ | IEC 60093 |
| Arc Resistance (s) | 87 | ASTM D495 |
| Dielectric Breakdown Strength (kV/mm) | 38 | IEC 60243-1 |
| Dielectric Constant / Dissipation Factor | IEC 60250 | |
| 100-Hz | 5.2 / 0.04 | |
| 1-kHz | 5.0 / 0.03 | |
| 100-kHz | 4.5 / 0.03 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
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LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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