LOCTITE STYCAST ES 6501 is a two-component epoxy encapsulant designed for general potting and encapsulation applications. It offers a rigid cure with low to medium viscosity and requires heat curing.
| Property | Value |
|---|---|
| Appearance – Mixed | Black |
| Appearance – Part A | Black liquid |
| Appearance – Part B | Yellow liquid |
| Mix Ratio (by weight) | 100:13 (Part A: Part B) |
| Mix Ratio (by volume) | 4.59:1 (Part A: Part B) |
| Mixed Viscosity @ 25°C (cP) | 3,380 (Spindle 3, 10 rpm) |
| Density | 1.53 |
| Working Time @ 25°C (100cc) | 30 to 60 min |
| Shelf Life (Cool, dry conditions) | 240 days |
| Cure Condition | Time |
|---|---|
| Room Temp (20-30°C) | 12 to 24 hours |
| Heat Cure (60-85°C) | 1 to 3 hours |
| Property | Value |
|---|---|
| Hardness (Shore D) | 85 |
| Glass Transition Temperature (Tg) | 57°C |
| Coefficient of Linear Thermal Expansion | 47 × 10⁻⁶ (Alpha 1: -10 to 30°C) 151 × 10⁻⁶ (Alpha 2: 70 to 110°C) |
| Thermal Conductivity | 0.46 W/(m-K) |
| Moisture Absorption (24h immersion) | 0.13% |
| Weight Loss (168 hrs @ 105°C) | 0.17% |
| Property | Value |
|---|---|
| Volume Resistivity (100 VDC) | 22 × 10¹⁷ ohm-cm |
| Surface Resistivity (100 VDC) | 7.7 × 10¹⁵ ohm |
| Arc Resistance | 87 sec |
| Dielectric Constant / Dissipation Factor | @ 1 kHz: 4.17 / 0.009 @ 100 kHz: 4.02 / 0.016 |
| Dielectric Strength (0.02″ thickness) | 1,175 V/mil |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
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