LOCTITE STYCAST US 0155 is a low-viscosity, flexible, flame-retardant urethane-based potting and encapsulating compound. It is designed primarily for potting indoor and outdoor telephone connector blocks and offers excellent adhesion to thermoplastic and thermoset materials, including ABS. The product provides good thermal conductivity and flame retardancy.
| Property | Part A | Part B | Mixed |
|---|---|---|---|
| Appearance | Amber | White | Tan |
| Density (g/cm³, 25°C) | 1.24 | 1.47 | 1.38 |
| Viscosity (cP, Brookfield RVF) | 200 (Spindle 2, 20 rpm) | 7,500 (Spindle 4, 12 rpm) | 3,500 (Spindle 6, 10 rpm) |
| Curing Condition | Time |
|---|---|
| Room temperature cure | 16 hours @ 25°C |
| Accelerated cure | 1–3 hours @ 60–85°C |
| Physical Properties | Value |
|---|---|
| Shore Hardness (Durometer A) | 83 |
| Water Absorption (24 hrs) | 0.1% |
| Tensile Strength | 320 psi |
| Elongation | 40% |
| Glass Transition Temperature (Tg) | 0°C |
| Coefficient of Thermal Expansion (ppm/°C) | 109 (below Tg), 153 (above Tg) |
| Thermal Conductivity | 0.47 W/(m·K) |
| Weight Loss after 168 hrs @ 125°C | 1.96% |
| Electrical Properties | Value |
|---|---|
| Dielectric Strength (20 mil) | 942 V/mil |
| Surface Resistivity @ 25°C | 8.5 × 10¹³ Ω |
| Volume Resistivity | 1.1 × 10¹⁴ Ω·cm |
| Dielectric Constant / Dissipation Factor @ 25°C | 6.85 / 0.09 (100 Hz) 5.96 / 0.13 (1 kHz) 4.2 / 0.08 (100 kHz) |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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