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Thermal Management

LOCTITE® STYCAST UV 7993 – Urethane Conformal Coating – Protective Layer for Printed Circuit Boards

Item Name: LOCTITE® STYCAST UV 7993
Manufacturer: Henkel
Technologies: Urethane
Color: Translucent yellow
Cure Type: Ultraviolet (UV) / Moisture cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months

1. Product Overview
LOCTITE STYCAST UV 7993 is a translucent yellow, single-component urethane conformal coating. It is UV-curable with a secondary room-temperature moisture cure for shadowed areas. This solvent-free material provides excellent moisture and chemical resistance, ensuring long-term protection of electronic assemblies under harsh operating conditions.

2. Applications
The product is designed for printed circuit board (PCB) protection. It is compatible with standard solder masks, no-clean fluxes, metallizations, substrates, and components, making it suitable for high-reliability electronics exposed to moisture and chemicals.

 

3. Typical Properties

Property Uncured Cured
Appearance Translucent yellow Tough protective coating
Viscosity (Brookfield), mPa·s 120
Specific Gravity 1.04
Shelf life @ 25°C 365 days
Cure mechanism UV + moisture Fully crosslinked
Recommended UVC cure (tack-free) >300 mJ/cm², 5–10 sec @ >60 mW/cm²
Recommended UVA cure >1,500 mJ/cm², 10–20 sec @ 150–300 mW/cm²
Moisture cure (shadowed areas) 50–100 h @ 25°C depending on humidity
Hardness 80 Shore A; 60 Shore D
Modulus 1,150 N/mm² (166,650 psi)
Volume resistivity 2.2 × 10¹⁶ ohm·cm
Dielectric strength 50 kV/mm
Dielectric constant 3.34
Dissipation factor 0.0131
Tensile strength 35 N/mm² (5,005 psi)

With fast UV curing, strong secondary moisture curing, and superior electrical insulation, LOCTITE STYCAST UV 7993 is well suited for conformal coating in advanced electronics.

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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