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Thermal Management

LOCTITE® STYCAST UV 7996 – Urethane Acrylate Conformal Coating – Protective Coating for Printed Circuit Boards

Item Name: LOCTITE® STYCAST UV 7996
Manufacturer: Henkel
Technologies: Urethane acrylate
Color: Clear liquid
Cure Type: UV and moisture cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months

1. Product Overview
LOCTITE STYCAST UV 7996 is a clear, single-component urethane acrylate conformal coating with positive fluorescence under UV light. It is solvent-free and designed to provide rugged protection against moisture and harsh chemicals. The product rapidly gels under UV exposure and completes curing via ambient moisture, ensuring reliable coverage even in shadowed areas. It complies with IPC-CC-830 requirements.

2. Applications
The coating is intended for printed circuit board (PCB) protection, offering excellent adhesion to solder masks, metallizations, components, and substrates. Its dual-cure mechanism makes it ideal for assemblies requiring robust insulation and chemical resistance in challenging environments.

 

3. Typical Properties

Property Uncured Cured
Appearance Clear liquid Transparent protective coating
Fluorescence Positive under UV light
Viscosity @ 25°C, mPa·s 70
Specific Gravity @ 25°C 1.04
Shelf life @ 25°C 365 days
Cure mechanism UV + moisture Fully crosslinked
Recommended UVC cure >75 mJ/cm², >3 sec @ >25 mW/cm²
Recommended UVA cure >500 mJ/cm², >5 sec @ >100 mW/cm²
Moisture cure (shadowed areas) 96–168 h @ 25°C depending on humidity
Hardness 54 Shore D
Modulus 426 N/mm² (61,770 psi)
Volume resistivity 5.88 × 10¹⁴ ohm·cm
Dielectric strength 27.9 kV/mm
Dielectric constant 3.20
Dissipation factor 0.05
Tensile strength 14.7 N/mm² (2,132 psi)

With its fast UV gelling, secondary moisture cure, and strong electrical and chemical resistance, LOCTITE STYCAST UV 7996 is a reliable conformal coating for advanced electronic assemblies.

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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