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LOCTITE® TLB 9300 APSi – Adhesive – Thermal Conductive Bonding

  • Item Name: LOCTITE® TLB 9300 APSi
  • Manufacturer: Henkel
  • Technologies: 2K Polyurethane
  • Color: Component A – Blue, Component B – White
  • Cure Type: Room Temperature or Heat Cure
  • Package Size: Contact to Techniq VN for details.
  • Shelf Life: 4 months

1. Product Overview

LOCTITE® TLB 9300 APSi is a two-component polyurethane adhesive with high thermal conductivity, moderate viscosity, good electrical insulation, and strong bonding performance.

Key Benefits:

  • High thermal conductivity (3.2 W/m·K)
  • Solvent-free formulation
  • Extended open time with rapid hardness buildup
  • Strong adhesion to aluminum and PET film

2. Applications

  • Thermal conductive bonding applications
  • Bonding of aluminum and PET film
  • Electronic assembly requiring high thermal conductivity

3. Typical Properties

Uncured Material

Property Component A Component B
Appearance Blue paste White paste
Viscosity (Pa.s @ 25°C, Rheometer) 205 150
Density (g/cc @ 25°C) 2.4 2.9
Mix Ratio (by volume) 1:1

Cured Material (25°C, 50% RH, 24h Cure)

Property Value
Density (g/cc) 2.65
Thermal Conductivity (W/m·K) 3.2
Hardness (Shore A) 93 (24h), 78 (60min), 88 (80min)
Working Time (@25°C) 32 min
Shrinkage (%) 0.6
Non-Volatile Content (%) 99.95
Flammability (2mm, UL 94V-0) Pass

Electrical & Mechanical Properties

Property Value
Dielectric Strength (ohm·cm) 2×10¹²
Breakdown Voltage (KV/mm) 18
Lap Shear Strength (MPa, 3003 Al) 2.6
180° Peel Strength (Al + PET film, gf/10mm) 540

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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