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MacDermid Alpha®- Alpha 870-25 and 871-25A liquid fluxes – engineered for wave soldering with reliable wetting, minimal bridging, and stable residues, ensuring consistent solder joint integrity for modern PCB assemblies.

  • Item Number: 870-25 / 871-25A

  • Manufacturer: MacDermid Alpha®

  • Flux Type/ Chemistry: Rosin-based, no-clean liquid flux

  • Viscosity/ Form: Low viscosity liquid

  • Activity/ Classification: No-clean; IPC J-STD-004 classification ROL0

  • Packaging: Contact to Techniq VN for details.

  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

Alpha 870-25 and 871-25A Liquid Fluxes are high-performance, no-clean fluxes designed for both lead-free and tin-lead soldering processes. They provide superior wetting, reliable solder joint formation, and minimal residues, ensuring consistent and high-quality performance in electronic assemblies. These fluxes are optimized for fine-pitch components and high-density PCB applications, delivering precision and repeatable soldering results.

2. Applications

Both fluxes are suitable for wave soldering, selective soldering, hand soldering, and rework operations. They are widely used in PCB assembly, repair, and rework processes where accurate and consistent soldering is critical. The fluxes perform effectively in both automated and manual soldering methods.

3. Typical Properties – Specifications

  • Flux Type: No-clean, mildly activated

  • Form: Liquid

  • Halogen Content: Halogen-free

  • Residues: Minimal, non-corrosive, compatible with no-clean processes

  • Compatibility: Works with lead-free and tin-lead solder alloys

  • Activation: Provides consistent wetting and reliable solder joints

  • Storage: Store in a cool, sealed container to maintain flux activity and shelf life

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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