Item Number: JP-501
Manufacturer: MacDermid Alpha®
Lead Type: Lead-Free (RoHS compliant)
Alloys: SAC305
Type: No-clean solder paste (fine-pitch, high-reliability)
Package: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
MacDermid Alpha JP-501 Solder Paste is a high-performance, no-clean solder paste designed for lead-free assembly processes. It provides excellent wetting, reliable solder joint formation, and consistent performance in fine-pitch and high-density surface mount assemblies. The paste leaves minimal, non-corrosive residues, making it suitable for no-clean processes and advanced electronics manufacturing.
JP-501 is suitable for surface mount technology (SMT) applications, including BGAs, QFNs, and other fine-pitch components. It supports stencil printing, syringe dispensing, and rework operations, ensuring precise and repeatable solder deposition. The paste is ideal for high-volume production environments where consistent performance and solder joint reliability are critical.
Alloy Composition: SAC305 (Sn96.5/Ag3.0/Cu0.5)
Flux Type: No-clean, halogen-free
Viscosity: Optimized for stencil printing and dispensing
Residues: Minimal, non-corrosive, safe for no-clean processes
Print Life: Extended stencil life under standard production conditions
Reflow Profile: Compatible with lead-free reflow temperature profiles
Storage: Refrigerated storage recommended to maintain paste consistency and performance
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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