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MacDermid Alpha OM-340 solder paste – formulated for high-volume SMT manufacturing, delivering wide reflow process latitude, excellent printability, and reliable solder joint integrity on fine-pitch, high-density assemblies.

  • Item Number: OM-340

  • Manufacturer: MacDermid Alpha®

  • Lead Type: Lead-Free (RoHS compliant)

  • Alloys: SAC305 (others available)

  • Type: No-clean solder paste

  • Package: 500 g jar; 600 g cartridge

  • Shelf Life: 6 months (refrigerated at 0–10 °C)

1. Product Overview

MacDermid Alpha OM-340 Solder Paste is a high-performance, no-clean solder paste formulated for lead-free assembly processes. It provides excellent wetting, reliable solder joint formation, and consistent performance in fine-pitch and high-density surface mount assemblies. The paste leaves minimal, non-corrosive residues, making it suitable for advanced electronics manufacturing and no-clean processes.

2. Applications

OM-340 is suitable for surface mount technology (SMT) applications, including BGAs, QFPs, and other fine-pitch components. It is compatible with stencil printing, syringe dispensing, and rework operations, ensuring precise and repeatable solder deposition. The paste is ideal for high-volume production environments where consistency and joint reliability are critical.

3. Typical Properties – Specifications

  • Alloy Composition: SAC305 (Sn96.5/Ag3.0/Cu0.5)

  • Flux Type: No-clean, halogen-free

  • Viscosity: Optimized for stencil printing and dispensing

  • Residues: Minimal, non-corrosive, safe for no-clean processes

  • Print Life: Extended stencil life under standard production conditions

  • Reflow Profile: Compatible with lead-free reflow temperature profiles

  • Storage: Refrigerated storage recommended to maintain paste consistency and performance

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