• Item Name: 832C Translucent Epoxy, Encapsulating & Potting Compound
• Manufacturer: MG Chemicals
• Technologies: Two-part epoxy system
• Color: Clear amber
• Cure Type: Room temperature (24 h) or heat cure (15–60 min depending on temperature)
• Package Size: 375 mL, 450 mL, 2.55 L, 60 L
• Shelf Life: 5 years
832C Translucent Epoxy Encapsulating & Potting Compound is a rigid, amber-clear epoxy that delivers outstanding environmental, mechanical, and electrical protection for printed circuit boards and electronic assemblies. With its low mixed viscosity, it penetrates small gaps and cavities effectively, ensuring thorough coverage. It provides excellent insulation against static discharge and safeguards components from vibration, abrasion, thermal shock, humidity, salt water, fungus, and aggressive chemicals. The compound exhibits high tensile and compressive strength, strong adhesion to a wide range of substrates, and long-term stability.
Encapsulation and potting of PCBs and sensitive electronic assemblies.
Electrical insulation in high-reliability environments.
Protection from vibration, abrasion, and thermal cycling.
Harsh environment sealing against water, humidity, and chemicals.
Applications requiring optical inspection through translucent epoxy.
| Property | Unmixed / Mixed (Before Cure) | Cured (After Application) |
|---|---|---|
| Chemistry | Epoxy | – |
| Density | 1.1 g/mL (Mixed), 1.1 g/mL (A), 1.0 g/mL (B) | 1.1 g/mL |
| Viscosity @ 25 °C | 2,700 cP (Mixed), 1,900 cP (A), 6,600 cP (B) | – |
| Mix Ratio | 2:1 (Volume), 2.3:1 (Weight) | – |
| Working Time | ~1 h (100 g sample) | – |
| Shrinkage | 1.6 % | – |
| Shelf Life | 5 years | – |
| Service Temperature Range | – | -40 to 140 °C (175 °C intermittent) |
| Glass Transition Temperature (Tg) | – | 53 °C |
| Coefficient of Thermal Expansion | – | 150 ppm/°C (below Tg), 161 ppm/°C (after Tg) |
| Hardness | – | 84 D |
| Tensile Strength | – | 45 N/mm² |
| Compressive Strength | – | 164 N/mm² |
| Lap Shear Strength | – | 17 N/mm² (SS), 18 N/mm² (Al), 3.8 N/mm² (ABS), 2.6 N/mm² (PC) |
| Electrical Resistivity | – | 6.7 × 10¹² Ω·cm |
| Dielectric Strength @ 3.175 mm | – | 483 V/mil (60,400 V breakdown) |
| Dielectric Constant @ 1 MHz | – | 2.8 |
| Dissipation Factor @ 1 MHz | – | 0.02 |
| Thermal Conductivity @ 25 °C | – | 0.3 W/(m·K) |
| Specific Heat Capacity @ 25 °C | – | 2.1 J/(g·K) |
| Thermal Diffusivity @ 25 °C | – | 0.2 mm²/s |
| Chemical Resistance (30 days @ 25 °C) | – | Low absorption in acids, bases, solvents; high resistance in oils |
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