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Thermal Management

MG Chemicals 8349TFM Thermal Adhesive – Epoxy Adhesive – Bonding Heatsinks to CPUs, LEDs, Electronics Components

Item Name: 8349TFM Thermal Adhesive
Manufacturer: MG Chemicals
Technologies: Two-part flame retardant, thermally conductive epoxy adhesive
Color: Dark grey
Cure Type: Room temperature (16 h) or oven cure (10–20 min depending on temperature)
Package Size: 45 mL, 200 mL
Shelf Life: 3 years

1. Product Overview

8349TFM Thermal Adhesive is a two-part, flame-retardant, thermally conductive epoxy adhesive. It has a dark grey, thixotropic paste consistency that cures to a strong, rigid polymer offering both thermal conductivity and electrical insulation. The adhesive exhibits high dimensional stability, strong mechanical strength, and resistance to humidity, salt water, mild bases, and hydrocarbons. It bonds effectively to a wide variety of substrates, making it ideal for electronics assembly where heat dissipation and reliability are critical.


2. Applications

  • Bonding heatsinks to CPUs, LEDs, and other heat-sensitive components.

  • Thermal management in electronic assemblies requiring both conductivity and insulation.

  • High-strength adhesive applications in humid, marine, or chemically challenging environments.

  • Electronics manufacturing where UL 94V-0 flame retardancy and stability are required.

3. Typical Properties

Property Unmixed / Mixed (Before Cure) Cured (After Application)
Mix Ratio 1:1 (Volume/Weight)
Density 1.6 g/mL (Mixed, A, B) 1.7 g/mL
Working Time 20 min
Shelf Life 3 years
Color Dark grey
Service Temperature Range -65 to 120 °C
Maximum Intermittent Temperature 200 °C
Glass Transition Temperature (Tg) 80 °C
Coefficient of Thermal Expansion 20 ppm/°C (below Tg), 120 ppm/°C (after Tg)
Resistivity 6.5 × 10¹² Ω·cm
Hardness 92 D
Tensile Strength 25 N/mm²
Compressive Strength 115 N/mm²
Lap Shear Strength 6.7 N/mm² (SS), 4.4 N/mm² (Al), 3.0 N/mm² (ABS), 0.9 N/mm² (PC)
Thermal Conductivity @ 25 °C 0.9 W/(m·K)
Specific Heat Capacity @ 25 °C 1.4 J/(g·K)
Thermal Diffusivity @ 25 °C 0.4 mm²/s

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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