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Momentive ECC3050S – Silicone Conformal Coating – High Volume PCB Assembly Protection for Electronics Industry

  • Item Name: ECC3050S

  • Manufacturer: Momentive Performance Materials

  • Technologies: Solventless, low viscosity silicone conformal coating

  • Color: Transparent

  • Cure Type: Room temperature moisture cure or low temperature oven cure (<60°C)

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

ECC3050S is a low-viscosity, solventless silicone conformal coating that cures rapidly at room temperature to form a soft, transparent silicone rubber. It can also be cured using a low-temperature oven (<60°C) to reduce handling times, making it suitable for high-volume production of printed circuit board assemblies, even with temperature-sensitive components. Key advantages include fast curing, low VOC formulation, excellent adhesion, low modulus for minimal stress, and suitability for spray or flow coating applications.


2. Applications

  • High-volume conformal coating of printed circuit boards (PCBs)

  • Protection of temperature-sensitive electronic components

  • Moisture and environmental protection for electronics

  • Suitable for spray or flow coating operations in controlled environments

3. Typical Properties

Property Before Curing After Curing (3 days @ 23°C/50% RH)
Viscosity (mPa·s, 23°C) 550
Tack-Free Time (min, 23°C/50% RH) 5
Cure Time (min, 23°C/50% RH) 30
Cure Time (min, 60°C/15% RH) 2
Appearance Transparent
Specific Gravity (23°C) 0.98
Hardness (Type A) 22
Volume Resistivity (MW·m / ohm·cm) 1×10⁷ / 1×10¹⁵
Dielectric Strength (kV/mm) 20 (508 v/mil)
Dielectric Loss (@60Hz) 0.001
Dielectric Constant (@60Hz) 2.60

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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