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Thermal Management

Momentive SILCOOL™ YG6260 – Thermally Conductive Silicone Compound – Heat Transfer for Electronics & Semiconductor Devices

  • Item Name: SILCOOL™ YG6260

  • Manufacturer: Momentive Performance Materials

  • Technologies: Metal oxide filled silicone oil, thermally conductive dielectric compound

  • Color: White, Opaque

  • Cure Type: Non-curing compound (stable across operating range)

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

SILCOOL YG6260 is a metal oxide-filled silicone oil compound designed for superior thermal conductivity. The high-purity fillers combined with silicone create a smooth, homogeneous, thermally conductive dielectric material with minimal oil separation and low weight loss at high temperatures. It exhibits excellent stability, little swelling effect on silicone elastomers, and operates over a wide temperature range from -40°C to 150°C.


2. Applications

  • Thermal management in electronics and semiconductor devices

  • Thermal joints and heat transfer interfaces

  • Power transistors, diodes, rectifiers, and radiator fans

  • Heat-generating components and heat exchangers

  • Aerospace, automotive, and industrial thermal management applications

3. Typical Properties

Property Unit Value
Appearance White-Opaque
Specific Gravity (25°C) 2.30
Penetration (JIS K 2220) 300
Thermal Conductivity W/m·K 0.84
Dielectric Constant (@60Hz) 5.0
Dissipation Factor (@60Hz) 0.005
Volume Resistivity Ω·cm 2.0×10¹⁵
Evaporation (150°C, 24h) % 0.1
Bleed (150°C, 24h) % 0.5

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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