
Electric Motor Reliability with Huntsman ARALDITE® Encapsulation Potting – Casting
Electric Motor Reliability with Huntsman ARALDITE® Encapsulation Potting – Casting
Item Name: TSE3280-G
Manufacturer: Momentive Performance Materials
Technologies: One-component, heat-curing silicone adhesive with thermal conductivity and dielectric properties
Color: Grey
Cure Type: Heat cure (100°C – 4h, 125°C – 2h, 150°C – 1h)
Package Size: 200 g tubes, 333 ml cartridges, 2 kg cans, 25 kg drums
Shelf Life: Contact to Techniq VN for details.
TSE3280-G is a one-component, medium-viscosity silicone adhesive that cures into an elastomer upon heating. It offers excellent thermal conductivity, good dielectric properties, and strong adhesion to a wide range of substrates without requiring a primer. Its formulation produces no cure by-products and exhibits low shrinkage, making it suitable for deep-section applications and use in enclosed assemblies. The product is non-corrosive and easy to handle, ensuring reliability in both industrial and electronic bonding applications.
Adhesive for electronic components and assemblies requiring thermal management.
Bonding to metals, glass, ceramics, and plastics without primer.
Encapsulating and sealing applications where dielectric properties are important.
Property | Before Mixing / Uncured | After Mixing / Cured (1 hr at 150°C) |
---|---|---|
Colour | Grey | Grey |
Viscosity (Pa·s) | 60 | – |
Density (g/cm³) | – | 2.10 |
Hardness (Type A) | – | 62 |
Tensile Strength (MPa) | – | 3.2 |
Elongation (%) | – | 110 |
Adhesion Strength (MPa) | – | 2.0 |
Dielectric Strength (kV/mm) | – | 21 |
Dielectric Constant (60Hz) | – | 4.3 |
Dissipation Factor (60Hz) | – | 0.002 |
Volume Resistivity (Ω·cm) | – | 2.5 × 10¹⁴ |
Thermal Conductivity (W/m·K) | – | 0.88 |
Linear Expansion (1/K) | – | 1.5 × 10⁻⁴ |
Electric Motor Reliability with Huntsman ARALDITE® Encapsulation Potting – Casting
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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