Applications

Momentive TSE3280-G – Thermally Conductive Silicone Adhesive – Heat Cure Bonding for Electronics & Industrial Assemblies

  • Item Name: TSE3280-G

  • Manufacturer: Momentive Performance Materials

  • Technologies: One-component, heat-curing silicone adhesive with thermal conductivity and dielectric properties

  • Color: Grey

  • Cure Type: Heat cure (100°C – 4h, 125°C – 2h, 150°C – 1h)

  • Package Size: 200 g tubes, 333 ml cartridges, 2 kg cans, 25 kg drums

  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

TSE3280-G is a one-component, medium-viscosity silicone adhesive that cures into an elastomer upon heating. It offers excellent thermal conductivity, good dielectric properties, and strong adhesion to a wide range of substrates without requiring a primer. Its formulation produces no cure by-products and exhibits low shrinkage, making it suitable for deep-section applications and use in enclosed assemblies. The product is non-corrosive and easy to handle, ensuring reliability in both industrial and electronic bonding applications.


2. Applications

  • Adhesive for electronic components and assemblies requiring thermal management.

  • Bonding to metals, glass, ceramics, and plastics without primer.

  • Encapsulating and sealing applications where dielectric properties are important.

3. Typical Properties

Property Before Mixing / Uncured After Mixing / Cured (1 hr at 150°C)
Colour Grey Grey
Viscosity (Pa·s) 60
Density (g/cm³) 2.10
Hardness (Type A) 62
Tensile Strength (MPa) 3.2
Elongation (%) 110
Adhesion Strength (MPa) 2.0
Dielectric Strength (kV/mm) 21
Dielectric Constant (60Hz) 4.3
Dissipation Factor (60Hz) 0.002
Volume Resistivity (Ω·cm) 2.5 × 10¹⁴
Thermal Conductivity (W/m·K) 0.88
Linear Expansion (1/K) 1.5 × 10⁻⁴

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