• Item Name: LOCTITE ABLESTIK ABP 8037TI
• Manufacturer: Henkel
• Technologies: Acrylate
• Color: Silver paste
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 month
LOCTITE ABLESTIK ABP 8037TI is a silver-filled acrylate adhesive formulated for high-reliability die attach applications. With 82% silver filler, it offers excellent electrical and thermal conductivity, strong adhesive performance, hydrophobicity, and stability at elevated temperatures. The material is ideal for attaching integrated circuits and components to metal leadframes and advanced substrates, including silver-plated copper and NiPdAu preplated leadframes.
Die attach on a wide variety of metals and ceramic surfaces
Attachment of ICs and components on silver-plated copper and preplated leadframes
High thermal and electrical conductivity assemblies requiring reliable performance
| Property | Unit | Still Not Mixed | After Mixed |
|---|---|---|---|
| Thixotropic Index (0.5/5 rpm) | – | 5.8 | – |
| Viscosity, Brookfield HA, 25°C, Spindle 51, 5 rpm | mPa·s (cP) | 11,000 | – |
| Work Life @ 25°C | hours | 24 | – |
| Shelf Life @ -40°C | days | 365 | – |
| Cure Schedule | – | 30 min ramp to 175°C, hold 30 min @175°C | Alternate: 30 min ramp to 150°C, hold 30 min @150°C |
| Coefficient of Thermal Expansion, below Tg | ppm/°C | – | 62 |
| Coefficient of Thermal Expansion, above Tg | ppm/°C | – | 94 |
| Glass Transition Temperature (Tg) | °C | – | 46 |
| Thermal Conductivity | W/(m·K) | – | 4.1 |
| Young’s Modulus (E) @ -65°C | N/mm² (psi) | – | 8,400 (1,218,317) |
| Young’s Modulus (E) @ 25°C | N/mm² (psi) | – | 5,900 (855,722) |
| Young’s Modulus (E) @ 100°C | N/mm² (psi) | – | 4,100 (594,654) |
| Young’s Modulus (E) @ 150°C | N/mm² (psi) | – | 2,900 (420,609) |
| Young’s Modulus (E) @ 200°C | N/mm² (psi) | – | 1,600 (232,060) |
| Young’s Modulus (E) @ 250°C | N/mm² (psi) | – | 1,300 (188,549) |
| Young’s Modulus (E) @ 300°C | N/mm² (psi) | – | 1,700 (246,564) |
| Extractable Ionic Content @100°C | ppm | – | Cl- 10, Na+ 20, K+ 1 |
| Volume Resistivity | ohm·cm | – | 6.00×10⁻⁵ |
| Die Shear Strength 120×120 mil Ag/Cu LF @25°C | Kg | – | 17.6 |
| Die Shear Strength 120×120 mil Ag/Cu LF @270°C | Kg | – | 7.4 |
| Die Shear Strength 120×120 mil Si on PPF LF @25°C | Kg | – | 17.5 |
| Die Shear Strength 120×120 mil Si on PPF LF @270°C | Kg | – | 6.9 |
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