Item Name: X-23-8033-1
Manufacturer: Shin-Etsu Silicones of America, Inc.
Technologies: Thermal interface grease, solvent-diluted, high conductivity
Color: White
Cure Type: Contact to Techniq VN for details.
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
Shin-Etsu X-23-8033-1 is a solvent-diluted thermal interface grease designed for high thermal conductivity applications. The solvent content makes it easy to apply and handle, while after solvent evaporation it maintains superior thermal conductivity for efficient heat transfer. It is stripped of low molecular weight siloxane, making it suitable for sensitive electronics.
CPUs
MPUs
Semiconductor elements and heat sinks requiring high thermal conductivity
| Property | Value / Description |
|---|---|
| Type | Thermal Grease |
| Component | Single component |
| Low Molecular Weight Siloxane Stripped | Yes |
| Color | White |
| Density @ 23 °C (g/cm³) | 3.48 |
| Viscosity (Pa·s) | 70 |
| Dielectric Strength (kV/mm) | 10.0 |
| Thermal Conductivity (W/m·K) | 4.00 |
| Thermal Resistance (mm²·K/W) | 10 |
| Volatile Content (%) | 0.93 |
| Bond Line Thickness (µm) | 32 |
| Usable Temperature Range (°C) | –40 to +200 |
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