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Shin-Etsu X-23-8033-1 – Solvent-diluted thermal grease for CPUs, MPUs, and semiconductor heat sinks.

  • Item Name: X-23-8033-1

  • Manufacturer: Shin-Etsu Silicones of America, Inc.

  • Technologies: Thermal interface grease, solvent-diluted, high conductivity

  • Color: White

  • Cure Type: Contact to Techniq VN for details.

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

Shin-Etsu X-23-8033-1 is a solvent-diluted thermal interface grease designed for high thermal conductivity applications. The solvent content makes it easy to apply and handle, while after solvent evaporation it maintains superior thermal conductivity for efficient heat transfer. It is stripped of low molecular weight siloxane, making it suitable for sensitive electronics.


2. Applications

  • CPUs

  • MPUs

  • Semiconductor elements and heat sinks requiring high thermal conductivity

3. Typical Properties

Property Value / Description
Type Thermal Grease
Component Single component
Low Molecular Weight Siloxane Stripped Yes
Color White
Density @ 23 °C (g/cm³) 3.48
Viscosity (Pa·s) 70
Dielectric Strength (kV/mm) 10.0
Thermal Conductivity (W/m·K) 4.00
Thermal Resistance (mm²·K/W) 10
Volatile Content (%) 0.93
Bond Line Thickness (µm) 32
Usable Temperature Range (°C) –40 to +200

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