Item Name: Shin-Etsu X23-7762
Manufacturer: Shin-Etsu MicroSi (SEM), USA
Technologies: Thermal interface material (TIM)
Color: Grey
Viscosity: 140 Pa·s (pre-flash), 700 Pa·s (post-flash)
Thermal Conductivity: 6.5 W/m·K (post-flash)
Thermal Resistance: 12.8 mm²·K/W
BLT (Bond Line Thickness): 72 µm (20 psi)
Package Sizes: Syringes (0.5 g, 1 g), Cartridges (55 g), Bulk (1 kg can), custom sizes available
Storage Conditions: 60–85 °F
Shelf Life: Contact Techniq VN for details
Shin-Etsu X23-7762 is a thermal interface material (TIM) designed for high-performance semiconductor devices. It combines high thermal conductivity (6.5 W/m·K post-flash) with low thermal resistance (12.8 mm²·K/W), ensuring excellent heat dissipation for improved device reliability. The product is low-viscosity during application, enabling easy dispensing, stencil printing, or screen printing, and becomes more viscous after solvent evaporation (“application chemical” flash-off). It is RoHS and REACH compliant and widely available in multiple package forms for production and field use.
Thermal management of high-performance semiconductor devices
Use in high-volume production environments requiring consistent thermal performance
Dispensing, stencil, or screen-printing application methods
| Property | Value / Description |
|---|---|
| Color | Grey |
| Viscosity (Pa·s, pre-flash) | 140 |
| Viscosity (Pa·s, post-flash) | 700 |
| Thermal Resistance (mm²·K/W) | 12.8 |
| Thermal Conductivity (W/m·K, post-flash) | 6.5 |
| BLT (Bond Line Thickness, µm @ 20 psi) | 72 |
| Packaging Options | Syringes (0.5 g, 1 g), Cartridges (55 g), Bulk (1 kg can), Custom sizes |
| Storage Conditions | 60 °F – 85 °F |
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