Applications

SilCool™ TSE3281 thermally conductive silicone adhesive for sealing and bonding heat-generating electronic components

  • Item Name: SilCool™ TSE3281

  • Manufacturer: Momentive Performance Materials

  • Technologies: One-component, heat-curable silicone adhesive

  • Color: Gray

  • Cure Type: Heat cure (120–150 °C)

  • Package Size: 1 kg can (case of 10), 25 kg pail

  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

SilCool TSE3281 is a one-component, heat-curable silicone adhesive designed for thermally conductive applications. It cures rapidly under heat and adheres strongly to a wide variety of substrates without the need for a primer. The product offers excellent thermal conductivity, high adhesive strength, and electrical insulation properties, making it suitable for bonding and sealing heat-generating electronic components.


2. Applications

  • Sealing and bonding for thermally conductive applications such as heat-generating elements, regulators, rectifiers, and thyristors.

  • Adhesive for metals, plastics, rubber, and inorganic substrates requiring thermal transfer.

3. Typical Properties

Property Uncured Cured (1h @ 150°C)
Appearance Flowable paste, gray Elastic rubber
Viscosity (Pa·s, 23°C) 60
Density (g/cm³) 2.70
Hardness (Type A) 84
Tensile Strength (MPa) 4.5
Elongation (%) 50
Adhesive Strength (MPa, Al lap shear) 2.5
Linear Expansion (1/K) 1.4 × 10⁻⁴
Thermal Conductivity (W/m·K) 1.7
Thermal Resistance (BLT: 50µm) 35
Volume Resistivity (Ω·cm) 4.8 × 10¹⁴
Dielectric Strength (kV/mm) 15
Dielectric Constant (60Hz) 5.2
Dissipation Factor (60Hz) 0.002

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