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Silicone-Free Heat Sink Compound – Thermally conductive paste for electronics to improve heat dissipation without silicone

  • Item Name: Silicone-Free Heat Sink Compound

  • Manufacturer: Techspray

  • Technologies: Silicone-free thermally conductive paste

  • Color: Gray

  • Cure Type: Contact to Techniq VN for details

  • Package Size: 4 oz. tube, 1 pound jar

  • Shelf Life: 5 years

1. Product Overview
Silicone-Free Heat Sink Compound (Product #1978) is a thermally conductive paste designed to efficiently transfer heat from electronic components to mechanical heat sinks. Ideal for applications where silicone contamination may interfere with soldering or cause defects, it maintains performance without separating, hardening, or cracking. With a thermal conductivity of 0.92 W/m-K and a wide functional temperature range, it is well-suited for electronic devices requiring reliable cooling. Non-ozone depleting and easy to apply, it ensures optimal thermal management without compromising component integrity.

2. Applications

  • Thermal bonding of electronic components to heat sinks

  • Electrical applications with thermocouple wells, thermistors, and calrods

  • Situations requiring silicone-free thermal interface to prevent solder defects

  • General electronic cooling and temperature management

3. Typical Properties

Property Value
Physical State Solid (paste)
Color Gray
Thermal Conductivity 0.92 W/m-K
Functional Temperature Range -40°F to 392°F (-40°C to 200°C)
Flash Point 564.8ºF (296ºC)
Boiling/Condensation Point 399.2ºF (204ºC)
Vapor Pressure 0.013 kPa (0.1 mmHg)
Evaporation Rate 0.01 (butyl acetate = 1)
Shelf Life 5 years
Packaging 4 oz. tube, 1 lb. jar

This compound provides consistent thermal performance while being safe for sensitive electronics and soldering processes, making it suitable for long-term heat management in critical applications.

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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