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SILTRUST™ ECC3050S – Fast-curing silicone conformal coating for protecting electronic printed circuit board assemblies

  • Item Name: SILTRUST™ ECC3050S

  • Manufacturer: Momentive Performance Materials

  • Technologies: Low viscosity, solventless silicone conformal coating

  • Color: Translucent

  • Cure Type: Moisture cure / room temperature or low-temperature oven cure

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

SILTRUST™ ECC3050S is a low-viscosity, solventless silicone conformal coating that cures rapidly at room temperature to form a soft, transparent silicone rubber. It can also be cured using a low-temperature oven process, making it suitable for high-volume PCB assembly production with temperature-sensitive components. The coating provides excellent long-term moisture protection and minimizes stress on sensitive components due to its low modulus.


2. Key Features and Benefits

  • Fast curing: Ready to handle in minutes

  • Solventless formulation: Safer and environmentally friendly

  • Low viscosity: Suitable for spray or flow coating applications

  • Excellent adhesion: Long-term protection against moisture

  • Low stress: Reduces CTE-induced stress on components

  • Flame retardant: UL94 V-0 recognized (File No. E135148)

3. Typical Physical Properties

Property Unit Value
Uncured Properties
Viscosity (23°C) mPa·s 550
Tack-Free Time (23°C, 50% RH) min 5
Cure Time (23°C, 50% RH) min 30
Cure Time (60°C, 15% RH) min 2
Cured Properties (3 days @ 23°C, 50% RH)
Appearance Translucent
Specific Gravity (23°C) 0.98
Hardness (Type A) 22
Volume Resistivity MΩ·cm 1 × 10⁷
Dielectric Strength kV/mm 20
Dielectric Loss (60 Hz) 0.001
Dielectric Constant (60 Hz) 2.60
Low Molecular Siloxane (D4–D10) wt % 0.01

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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