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SnapSil™ TN3305 silicone adhesive sealant for insulating, waterproof sealing, and bonding electronic components

  • Item Name: SnapSil™ TN3305

  • Manufacturer: Momentive Performance Materials

  • Technologies: One-component, low-volatile siloxane, silicone adhesive sealant

  • Color: Clear, white, black

  • Cure Type: Room temperature, moisture cure (alcohol vapor release)

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

SnapSil TN3305 is a one-component, low-volatility silicone adhesive sealant that cures at room temperature upon exposure to atmospheric moisture. It provides primerless adhesion to many substrates, is non-corrosive to most metals, and releases a low-odor alcohol vapor during cure. The product is flame-retardant (UL94 HB recognized) and fast-tack curing, making it suitable for electrical and electronic applications that require reliable insulation, bonding, and sealing.


2. Applications

  • Insulating adhesive seal and fixing for electrical and electronic parts.

  • Waterproof sealant for electrical, electronic, and communication equipment.

  • General adhesive for metals, glass, plastics, and other substrates.

3. Typical Properties

Property Uncured Cured (3 days @ 23°C, 50% RH)
Appearance Flowable; clear, white, black Elastic rubber; clear, white, black
Viscosity (Pa·s, 23°C) 47
Tack-free Time (min, 23°C) 9
Density (g/cm³) 1.04
Hardness (Type A) 14
Tensile Strength (MPa) 1.5
Elongation (%) 400
Adhesion Strength (MPa) 1.0
Volatile Siloxane (wt%) 0.01
Volume Resistivity (Ω·cm) 2.0 × 10¹⁵
Dielectric Strength (kV/mm) 26
Dielectric Constant (60Hz) 2.7
Dissipation Factor (60Hz) 0.002
Impurities (ppm) Na⁺ <2; K⁺ <2; Cl⁻ <2

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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