Item Name: SNAPSIL™ TSE322S
Manufacturer: Momentive Performance Materials
Technologies: One-component, heat-curable silicone adhesive sealant
Color: Light blue
Cure Type: Heat cure (100 °C – 3 h, 120 °C – 90 min, 150 °C – 60 min)
Package Size: Tubes, 333 ml cartridges, 1 kg cans, 20 kg pails
Shelf Life: Contact to Techniq VN for details.
SNAPSIL TSE322S is a one-component, heat-curable silicone adhesive sealant paste that bonds to a wide variety of substrates without the need for a primer. It features low shrinkage, non-corrosive behavior, excellent dielectric properties, and stable performance across a wide temperature range.
Adhesive and sealant for metals, plastics, rubbers, glass, and ceramics.
High-performance bonding in electronic, electrical, and industrial assemblies.
Suitable for use where primerless adhesion is required; optional primer (SS4155) can enhance adhesion on difficult substrates.
| Property | Uncured | Cured (1h @ 150°C) |
|---|---|---|
| Colour | Light Blue | – |
| Appearance | Semi-flowable | – |
| Viscosity (Pa·s, 23°C) | 70 | – |
| Density (g/cm³, 23°C) | 1.26 | – |
| Hardness (Type A) | – | 37 |
| Elongation (%) | – | 230 |
| Tensile Strength (MPa) | – | 3.6 |
| Adhesive Strength (MPa, Al lap shear) | – | 2.5 |
| Dielectric Strength (kV/mm) | – | 25 |
| Dielectric Constant (60Hz) | – | 3.1 |
| Dissipation Factor (60Hz) | – | 0.006 |
| Volume Resistivity (Ω·cm) | – | 1.0 × 10¹⁵ |
| Thermal Coefficient of Expansion (1/K) | – | 2.1 × 10⁻⁴ |
| Thermal Conductivity (W/m·K) | – | 0.29 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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