SYLGARD™ 182 is a transparent, two-part, heat-cure silicone elastomer with a 10:1 mix ratio by weight or volume. It offers long pot life, deep section curing, and good dielectric properties. The material is flexible, low-stress, repairable, and free of solvents or cure byproducts.
SYLGARD™ 182 is used for general potting and encapsulation in various electrical and industrial applications, including:
| Property | Unit | Part A (Base) |
|---|---|---|
| Viscosity | cP | 5,475 |
| Mix Ratio (Base: Curing Agent) | – | 10:1 |
| Property | Unit | Result |
|---|---|---|
| Viscosity (Mixed) | cP | 4,575 |
| Pot Life (25°C) | Hours | 8 |
| Cure Time at 25°C | Hours | 336 |
| Heat Cure Time at 100°C | Minutes | 75 |
| Heat Cure Time at 125°C | Minutes | 30 |
| Heat Cure Time at 150°C | Minutes | 20 |
| Property | Unit | Result |
|---|---|---|
| Specific Gravity | – | 1.03 |
| Tensile Strength | psi | 1,105 |
| Elongation | % | 105 |
| Tensile Modulus | psi | 1,050 |
| Tear Strength (Die B) | ppi | 25 |
| Hardness (Shore A) | – | 51 |
| Dielectric Strength | Volts/mil | 475 |
| Volume Resistivity | ohm*cm | 1.61E+15 |
| Dielectric Constant (100 Hz / 100 kHz) | – | 2.65 |
| Dissipation Factor (100 Hz / 100 kHz) | – | 0.0005 |
| Refractive Index | – | 1.41 |
| Linear Coefficient of Thermal Expansion (CTE) | ppm/°C | 325 |
| Thermal Conductivity | W/m·K | 0.16 |
| UL Flammability Classification | – | 94 V-1 |
| Shelf Life (25°C) | Months | 24 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.