SYLGARD™ 517 Dielectric Gel Kit is a two-part, clear silicone gel designed for sealing and protecting delicate electronic components. It features low viscosity, a 1:1 mixing ratio, and cures at room or elevated temperatures without by-products. The gel exhibits self-healing properties, permanent adhesion to most materials, and remains stable and flexible from -50°C to +200°C.
SYLGARD™ 517 Dielectric Gel Kit is used for:
| Property | Unit | Part A | Part B | Test Method |
|---|---|---|---|---|
| Color | – | Clear | Clear | CTM 0176 |
| Viscosity at 23°C | mPa.s | 450 | 450 | ASTM D1084 |
| Property | Unit | Result | Test Method |
|---|---|---|---|
| Viscosity at 23°C | mPa.s | 450 | ASTM D1084 |
| Specific Gravity at 23°C | – | 0.97 | ASTM D0792 |
| Property | Unit | Result | Test Method |
|---|---|---|---|
| Color | – | Clear | CTM 0176 |
| Penetration | mm × 10⁻¹ | 45 | – |
| Dielectric Strength | kV/mm | 15 | ASTM D0149 |
| Volume Resistivity | Ohm.cm | 3×10¹⁵ | ASTM D257 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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