SYLGARD™ 527 Silicone Dielectric Gel is a two-part, 1:1 mix ratio silicone gel designed for sealing and protecting PCB system assemblies, particularly those with delicate components. It offers low viscosity for good flow, room temperature or heat-accelerated curing, and availability in clear or red color. This gel provides excellent dielectric properties, stress relief, and self-healing characteristics after curing.
| Property | Unit | Part A | Part B |
|---|---|---|---|
| Color | – | Clear or Red | Clear or Red |
| Viscosity | cP | 470 | 454 |
| Specific Gravity | – | 0.95 | 0.95 |
| Property | Unit | Value |
|---|---|---|
| Viscosity (Mixed) | cP | 465 |
| Specific Gravity | – | 0.95 |
| Working Time (Pot Life) at 25°C | hr | 1.98 |
| Heat Cure Time (T90) at 100°C | min | 210 |
| Heat Cure Time (T90) at 125°C | min | 75 |
| Heat Cure Time (T90) at 150°C | min | 35 |
| Property | Unit | Value |
|---|---|---|
| Gel Hardness | grams | 113 |
| Penetration (¼ cone) | mm/10 | 55 |
| Dielectric Strength | V/mil (kV/mm) | 425 (17) |
| Dielectric Constant at 100 Hz | – | 2.85 |
| Dielectric Constant at 100 kHz | – | 2.85 |
| Volume Resistivity | ohm·cm | 2.75 × 10¹⁵ |
| Dissipation Factor at 100 Hz | – | 0.002 |
| Dissipation Factor at 100 kHz | – | 0.0001 |
| Linear Coefficient of Thermal Expansion (CTE) | ppm/°C | 335 |
| Operating Temperature Range | °C | -45 to 150 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.