SYLGARD™ 527 Silicone Dielectric Gel is a two-part, 1:1 mix ratio silicone gel designed for sealing and protecting PCB system assemblies, particularly those with delicate components. It offers low viscosity for good flow, room temperature or heat-accelerated curing, and availability in clear or red color. This gel provides excellent dielectric properties, stress relief, and self-healing characteristics after curing.
| Property | Unit | Part A | Part B |
|---|---|---|---|
| Color | – | Clear or Red | Clear or Red |
| Viscosity | cP | 470 | 454 |
| Specific Gravity | – | 0.95 | 0.95 |
| Property | Unit | Value |
|---|---|---|
| Viscosity (Mixed) | cP | 465 |
| Specific Gravity | – | 0.95 |
| Working Time (Pot Life) at 25°C | hr | 1.98 |
| Heat Cure Time (T90) at 100°C | min | 210 |
| Heat Cure Time (T90) at 125°C | min | 75 |
| Heat Cure Time (T90) at 150°C | min | 35 |
| Property | Unit | Value |
|---|---|---|
| Gel Hardness | grams | 113 |
| Penetration (¼ cone) | mm/10 | 55 |
| Dielectric Strength | V/mil (kV/mm) | 425 (17) |
| Dielectric Constant at 100 Hz | – | 2.85 |
| Dielectric Constant at 100 kHz | – | 2.85 |
| Volume Resistivity | ohm·cm | 2.75 × 10¹⁵ |
| Dissipation Factor at 100 Hz | – | 0.002 |
| Dissipation Factor at 100 kHz | – | 0.0001 |
| Linear Coefficient of Thermal Expansion (CTE) | ppm/°C | 335 |
| Operating Temperature Range | °C | -45 to 150 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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