SYLGARD™ 537 One Part Dielectric Gel is a one-part, clear dielectric gel designed for sealing, coating, encapsulating, and potting electronic devices. It features:
SYLGARD™ 537 is widely used for:
| Property | Unit | Value |
|---|---|---|
| Before Cure | ||
| Viscosity | cP / mPa·s / Pa·s | 375 / 375 / 0.4 |
| Heat Cure Time @120°C | Minutes | 60 |
| After Cure | ||
| Gel Hardness | Grams | 290 |
| Penetration | 1/10 mm | 20 |
| Storage & Shelf Life | ||
| Shelf Life (at 5°C) | Months | 9 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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